Conference
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[C4]: R. Wang, R. Xu, X. Zhao, K. Jiang, X. Guo, “CINEMA: A Configurable Binary Segmentation Based Arithmetic Module for Mixed-Precision In-Memory Acceleration”, Accepted by IEEE International Symposium on Circuits & Systems (ISCAS), Singapore, May 2024.
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[C3]: X. Zhao, T. Wang, R. Jiao, X. Guo, “Standard Cells Do Matter: Uncovering Hidden Connections for High-Quality Macro Placement”, Accepted by Design, Automation and Test in Europe Conference (DATE), Valencia, Spain, March 2024. Regular paper, Acceptance Rate: 25%
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[C2]: X. Zhao, Y. Gao, V. Verma, R. Xu, M. Stan, X. Guo, “Design Space Exploration of Layer-Wise Mixed-Precision Quantization with Tightly Integrated Edge Inference Units”, Great Lakes Symposium on VLSI (GLSVLSI), Knoxville, USA, June 2023
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[C1]: X. Zhao, R. Xu, X. Guo, “Post-training Quantization or Quantization-aware Training? That is the Question”, China Semiconductor Technology International Conference (CSTIC), Shanghai, China, June 2023
Workshop
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[W1]: X. Zhao, Y. Gao, V. Verma, R. Xu, M. Stan, X. Guo, “Design Space Exploration of Layer-Wise Mixed-Precision Quantization with Tightly Integrated Edge Inference Units”, Design Automation Conference (DAC), Work-in-Progress (WIP) Poster Session, San Francisco, CA, July 2023
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[W2]: X. Zhao, Y. Gao, V. Verma, R. Xu, M. Stan, X. Guo, “Design Space Exploration of Layer-Wise Mixed-Precision Quantization with Tightly Integrated Edge Inference Units”, National Microelectronics Graduate Academic Forum 2022, Beijing, March 2023
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[W3]: X. Zhao, X. Guo, “DAG-MP: Enabling High-Quality Macro Placement with Enhanced Dataflow-Aware Guidance”, Semiconductor Technology Forum 2022, Shanghai, December 2022
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[W4]: X. Zhao, V. Verma, Y. Gao, R. Xu, M. Stan, X. Guo, “TILE-MPQ: Design Space Exploration of Tightly Integrated Layer-Wise Mixed-Precision Quantized Units for TinyML Inference”, TinyML Asia, Virtual, November 2022
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[W5]: X. Guo, X. Zhao, V. Verma, M. Stan, “Extending RISC-V ISA for Tightly Integrated Inference at the Edge”, RISC-V Summit China 2022 (RVSC2022), Virtual, August 2022
